PRINCIPLE

	magnetic flux method	riquid panetrant method	x-ray method	ultrasonic method	eddy current method	MDK method
signals	magnetic particle absorption	liquid soaking	panetrating x-ray	reflectiv ultrasound	electromagnetic induction eddy current	penetrating magnetic flux
failure position	surface layer	surface area	internal	internal	surface layer	deep area
detecting failures	cracking scratches pinholes	surface cracks pinholes scratches	cracking poor bonding foreign body	cracking scratches poor bonding foreign body	cracking scratches pinholes	cracks scratches pinholes metarial quality thickness fatigue stress
characteristics	washing required afterwards bad resorution	washing required afterwards bad resorution	limited samples controlled area	solvent required	bad resolution	high speed analysis haigh resolution